工业工程

工业工程 ›› 2011, Vol. 14 ›› Issue (3): 141-145.

• 实践与应用 • 上一篇    

基于电子器件失效分析流程对失效LED分析方法的研究

  

  1. 1.广东工业大学 实验教学部，广东 广州 510006;2.信息产业部电子五所 电子产品可靠性物理国家重点实验室，广东 广州 510610
  • 出版日期:2011-06-30 发布日期:2011-07-08
  • 作者简介:赵巍（1984-），男，河北省人，硕士研究生，主要研究方向为光电子器件可靠性.

Study on LED Failure Analysis Method Based on Electronic Device Failure Analysis Theory

  1. 1. Department of Experiment Education, Guangdong University of Technology, Guangzhou 510006,China;2.National Key Laboratory for Reliability Physics of Electronic Product, The No.5 Institute of MII, Guangzhou 510610， China
  • Online:2011-06-30 Published:2011-07-08

摘要： 结合一般电子器件失效分析方法，系统地设计了针对已失效LED器件的分析流程，并从封装结构和光、热特性几个方面比较了LED与一般器件失效分析方法的不同之处。通过分析发现了一般分析难以检测到的表面污染物污染、内部芯片断层等失效模式。实验证明,此方法对判断LED失效模式、推测失效机理更加准确，并可以有效地避免一般分析方法中过早的破坏性分析引入的损伤，以及将光电检测中电流和温度应力导致的损伤误判为器件原有失效因素。

关键词: LED失效, 失效分析方法, 失效分析设备

Abstract: In reference to the general electronic device failure analysis method, a systematic LED failure analysis process is proposed. The differences and similarities in package structure, light, and heat transfer characteristics between LED and general electronic devices are analyzed. Based on the analysis, it discovers some failure modes, such as the chip surface pollutants and internal chip faults, that are difficult to be detected by the existing methods. Experiments show that the proposed analysis method is more accurate in judging the LED failure modes and conjecturing the mechanism. Furthermore, this method can effectively avoid new damages which are introduced by destructive analysis. It can also avoid the mistake that takes the damages resulting from the analysis techniques to be the original ones.

Key words: LED failure, failure analysis methods, failure analysis device