Abstract: To ensure that the quality of wafers meets market demands, wafer manufacturers must strictly control the residency time in tank-based wafer manufacturing systems with wafer cleaning operations, a common process in the semiconductor manufacturing field. However, when processing multiple types of wafers in tank-based wafer manufacturing systems, the constraints of wafer residency time and the scheduling of wafer cleaning operations significantly increase the complexity of the scheduling problem. To address this challenge, we first analyze the impact of residency time constraints and chamber cleaning operations on system scheduling when processing multiple types of wafers simultaneously. Then, by using a straightforward backword strategy, we develope a novel scheduling method, with the key focusing on determining the waiting time of the robot at each step. Based on this approach, feasibility conditions for wafer processing is derived, and a corresponding scheduling algorithm is developed to implement cyclic scheduling. Finally, we provide numerical examples to verify the feasibility and effectiveness of the proposed method.