基于可解释深度学习的晶圆制造工期预测方法

    An Explainable Deep Learning Approach for Cycle Time Prediction in Wafer Fabrication

    • 摘要: 在现代晶圆制造系统中,作业工期的精确预测对提高生产计划的可靠性、优化资源配置与提升工厂整体运营效率具有重要价值。然而,由于制造流程高度复杂,作业之间相互依赖且特征数据呈现非线性和高维特性,传统预测方法在实际应用中存在性能瓶颈。为应对上述挑战,本文提出一种基于可解释深度学习的工期预测方法,融合了Transformer神经网络与模型可解释性技术。首先构建以作业规模、瓶颈前排队长度、工厂在制品量等关键生产特征为输入的数据集,并进行标准化与时间序列处理。随后,利用Transformer模型对特征间复杂关系建模,实现对作业工期的高精度预测。在模型训练完成后,引入LIME和SHAP两种方法从局部与全局角度揭示模型预测的依据,识别影响预测结果的关键因素。实验基于真实晶圆制造数据集开展,对比传统机器学习模型与深度学习基线模型,验证了所提方法在预测准确性与模型可解释性方面的综合优势。研究结果表明,本文方法不仅在数值上显著提升了预测性能,也为工厂调度系统的智能化与透明化提供了技术支持,具有较高的实际应用潜力。

       

      Abstract: In modern wafer-fabrication systems, accurate prediction of job lead times is critically important for enhancing the reliability of production planning, optimizing resource allocation, and improving overall factory operational efficiency. However, the highly complex nature of the manufacturing process—characterized by strong interdependencies among jobs and by feature data that are both nonlinear and high-dimensional—poses significant challenges to traditional prediction methods, which often encounter performance bottlenecks in practical applications. To address these challenges, this paper proposes an interpretable deep-learning approach for lead-time prediction that integrates a Transformer neural network with model explainability techniques. First, a dataset is constructed using key production features—such as job size, queue length upstream of bottlenecks, and factory work-in-process—and subjected to normalization and time-series preprocessing. Next, a Transformer model is employed to capture and model the complex relationships among these features, enabling highly accurate lead-time predictions. Upon completion of model training, both LIME and SHAP methods are applied to elucidate the model's decision-making process from local and global perspectives, thereby identifying the principal factors influencing prediction outcomes. Experiments conducted on a real-world wafer-manufacturing dataset compare the proposed method against conventional machine-learning models and deep-learning baselines. The results demonstrate that the proposed approach not only achieves a marked improvement in numerical prediction accuracy but also delivers enhanced interpretability. This dual advantage provides robust technical support for the intelligent and transparent scheduling of wafer-fabrication systems and underscores the method's strong potential for practical deployment.

       

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