Abstract: In reference to the general electronic device failure analysis method, a systematic LED failure analysis process is proposed. The differences and similarities in package structure, light, and heat transfer characteristics between LED and general electronic devices are analyzed. Based on the analysis, it discovers some failure modes, such as the chip surface pollutants and internal chip faults, that are difficult to be detected by the existing methods. Experiments show that the proposed analysis method is more accurate in judging the LED failure modes and conjecturing the mechanism. Furthermore, this method can effectively avoid new damages which are introduced by destructive analysis. It can also avoid the mistake that takes the damages resulting from the analysis techniques to be the original ones.