基于多尺度估计理论的晶圆减薄工艺方差变化检测方法
刘飏, 高文科, 张志胜, 史金飞
A Study of the Standard Deviation Change in the Wafer Thinning Process Based on the Multiscale Estimation Theory
LIU Yang, GAO Wenke, ZHANG Zhisheng, SHI Jinfei
工业工程
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2018, (3): 75
-81
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DOI: 10.3969/j.issn.1007-7375.2018.03.009
